CHINAPLAS 2026 Technology Trends: Digital Printing, Sustainable Adhesives, and Market Outlook
A technical review of CHINAPLAS 2026 innovations covering HP Indigo 200K digital printing, bio-based adhesives from tesa, and Avery Dennison ADvantage Digital materials for label converters.
CHINAPLAS 2026 Key Highlights for the Packaging Industry
CHINAPLAS 2026 showcased HP Indigo 200K, tesa bio-based adhesives, and Avery Dennison digital label materials, signaling a fast shift toward digital and sustainable packaging.
CHINAPLAS 2026 Highlights: Digital Printing, Sustainable Adhesives, and the Future of Packaging
The 38th China International Plastic and Rubber Industry Exhibition (CHINAPLAS 2026) showcased the convergence of digital printing and sustainable adhesives, signaling a new era for packaging. Key innovations from HP Indigo and tesa SE highlight the industry’s shift toward efficiency and environmental responsibility.
Sustainable Packaging Materials Market Trends 2026
The 38th China International Plastic and Rubber Industry Exhibition showcased HP Indigo 200K, tesa’s bio-based adhesives, and the industry’s shift toward digital and sustainable solutions.